Chip Packaging

Chip packaging mainly installed semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the bridge of the internal and external communication chip circuit, chip the contacts with wire is connected to the encapsulation of shell on the pins of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role in Cpus and other LSI integrated circuits. The chip packaging technology has gone through several generations of changes, from DIP, QFP, PGA, BGA, CSP to MCM. The technical indicators are more and more advanced from generation to generation, including the ratio of chip area to package area getting closer to 1, the application frequency getting higher and higher, and the temperature resistance performance getting better and better. More pins, less pin spacing, less weight, more reliability, more convenience, etc According to the type breakdown, all markets for chip packaging can be divided into the following categories: The first category is mainly traditional packaging, which has a relatively large share of the global market, accounting for about 55.95% in 2019. The other major category is advanced packaging. For many companies, advanced packaging technology is very attractive. Advanced packaging technology is the core of all semiconductor manufacturing processes today. For all semiconductor companies, advanced packaging technology is responding to major trends such as 5G, artificial intelligence and the Internet of Things. Advanced packaging will account for 45.33% of the market by 2020. From a regional perspective, The market share of Taiwan’s market output value in 2019 is relatively large, accounting for 44.76% of the market, which will maintain steady growth in the next few years. With a market share of 34.62% in terms of output, China and 11.23% in terms of output, the U.S. will continue to play an important role that cannot be ignored. Any change in China or Taiwan could affect the trend in chip packaging. Japan, the rest of the Asia-Pacific region and other countries/regions also play an important role in the global market, but their market share will be lower in certain regions. The chip packaging market consists of a group of well-known brand manufacturers and new entrants. The world’s leading players in the chip packaging market are Ase, Anyou technology, Changdian Technology, Spil, Lisheng Technology, Tonfu Microelectronics, Tianshui Huatian, United Technology, Qibang Technology, Hana Micron, etc. These top 10 companies now account for more than 78 per cent of the total market share and are expected to maintain their dominance over the forecast period. As consumer interest increases, this market will attract other major companies that want to expand their brand equity.

Market Analysis and Insights:

Global Chip Packaging Market The global Chip Packaging market size is projected to reach US$ 4047.9 million by 2026, from US$ 2808 million in 2019, at a CAGR of 6.7% during 2021-2026.

Get Sample Copy of This Report @

https://www.qyresearch.com/sample-form/form/2629521/global-chip-packaging-market

With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global Chip Packaging market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global Chip Packaging market in terms of revenue. On the whole, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global Chip Packaging market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global Chip Packaging market.

Chip Packaging Breakdown Data by Type

Traditional Packaging, Advanced Packaging

Chip Packaging Breakdown Data by Application

Motor Vehicles and Transport, Consumer Electronics, Communication, Other Based on regional and country-level analysis,

the Chip Packaging market has been segmented as follows:,

North America, United States, Canada, Europe, Germany, France, U.K., Italy, Russia, Nordic, Rest of Europe, Asia-Pacific, China, Japan, South Korea, Southeast Asia, India, Australia, Rest of Asia-Pacific, Latin America, Mexico, Brazil, Middle East & Africa, Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa In the competitive analysis section of the report, leading as well as prominent players of the global Chip Packaging market are broadly studied on the basis of key factors. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2016-2021. It also offers detailed analysis supported by reliable statistics on price and revenue (global level) by player for the period 2016-2021.

The following players are covered in this report:

, ASE, Amkor, JCET Group, Spil, Pti, Tongfu Microelectronics Co., Ltd., Tianshui Huatian Technology Co., LTD, UTAC Holdings Ltd, Chipbond Technology Corporation, Spil, Pti, East China Science and Technology Co. LTD, NEPES, Unisem, ChipMOS Technologies, Signitec, Carsem, King Yuan Electronics CO., LTD.

Get Full Report In Your Inbox Within 24 Hours at USD(3900):

https://www.https://www.qyresearch.com/settlement/pre/8e5c49fffa1dcad3b303b5861e361cdc,0,1,global-chip-packaging-market

Table of Contents

1 Report Overview 1.1 Study Scope 1.2 Market Analysis by Type
1.2.1 Global Chip Packaging Market Size Growth Rate by Type: 2016 VS 2021 VS 2027
1.2.2 Traditional Packaging
1.2.3 Advanced Packaging 1.3 Market by Application
1.3.1 Global Chip Packaging Market Share by Application: 2016 VS 2021 VS 2027
1.3.2 Motor Vehicles and Transport
1.3.3 Consumer Electronics
1.3.4 Communication
1.3.5 Other 1.4 Study Objectives 1.5 Years Considered 2 Global Growth Trends 2.1 Global Chip Packaging Market Perspective (2016-2027) 2.2 Chip Packaging Growth Trends by Regions
2.2.1 Chip Packaging Market Size by Regions: 2016 VS 2021 VS 2027
2.2.2 Chip Packaging Historic Market Share by Regions (2016-2021)
2.2.3 Chip Packaging Forecasted Market Size by Regions (2022-2027) 2.3 Chip Packaging Industry Dynamic
2.3.1 Chip Packaging Market Trends
2.3.2 Chip Packaging Market Drivers
2.3.3 Chip Packaging Market Challenges
2.3.4 Chip Packaging Market Restraints 3 Competition Landscape by Key Players 3.1 Global Top Chip Packaging Players by Revenue
3.1.1 Global Top Chip Packaging Players by Revenue (2016-2021)
3.1.2 Global Chip Packaging Revenue Market Share by Players (2016-2021) 3.2 Global Chip Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3) 3.3 Players Covered: Ranking by Chip Packaging Revenue 3.4 Global Chip Packaging Market Concentration Ratio
3.4.1 Global Chip Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chip Packaging Revenue in 2020 3.5 Chip Packaging Key Players Head office and Area Served 3.6 Key Players Chip Packaging Product Solution and Service 3.7 Date of Enter into Chip Packaging Market 3.8 Mergers & Acquisitions, Expansion Plans 4 Chip Packaging Breakdown Data by Type 4.1 Global Chip Packaging Historic Market Size by Type (2016-2021) 4.2 Global Chip Packaging Forecasted Market Size by Type (2022-2027) 5 Chip Packaging Breakdown Data by Application 5.1 Global Chip Packaging Historic Market Size by Application (2016-2021) 5.2 Global Chip Packaging Forecasted Market Size by Application (2022-2027) 6 North America 6.1 North America Chip Packaging Market Size (2016-2027) 6.2 North America Chip Packaging Market Size by Type
6.2.1 North America Chip Packaging Market Size by Type (2016-2021)
6.2.2 North America Chip Packaging Market Size by Type (2022-2027)
6.2.3 North America Chip Packaging Market Size by Type (2016-2027) 6.3 North America Chip Packaging Market Size by Application
6.3.1 North America Chip Packaging Market Size by Application (2016-2021)
6.3.2 North America Chip Packaging Market Size by Application (2022-2027)
6.3.3 North America Chip Packaging Market Size by Application (2016-2027) 6.4 North America Chip Packaging Market Size by Country
6.4.1 North America Chip Packaging Market Size by Country (2016-2021)
6.4.2 North America Chip Packaging Market Size by Country (2022-2027)
6.4.3 United States
6.4.3 Canada 7 Europe 7.1 Europe Chip Packaging Market Size (2016-2027) 7.2 Europe Chip Packaging Market Size by Type
7.2.1 Europe Chip Packaging Market Size by Type (2016-2021)
7.2.2 Europe Chip Packaging Market Size by Type (2022-2027)
7.2.3 Europe Chip Packaging Market Size by Type (2016-2027) 7.3 Europe Chip Packaging Market Size by Application
7.3.1 Europe Chip Packaging Market Size by Application (2016-2021)
7.3.2 Europe Chip Packaging Market Size by Application (2022-2027)
7.3.3 Europe Chip Packaging Market Size by Application (2016-2027) 7.4 Europe Chip Packaging Market Size by Country
7.4.1 Europe Chip Packaging Market Size by Country (2016-2021)
7.4.2 Europe Chip Packaging Market Size by Country (2022-2027)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic 8 Asia-Pacific 8.1 Asia-Pacific Chip Packaging Market Size (2016-2027) 8.2 Asia-Pacific Chip Packaging Market Size by Type
8.2.1 Asia-Pacific Chip Packaging Market Size by Type (2016-2021)
8.2.2 Asia-Pacific Chip Packaging Market Size by Type (2022-2027)
8.2.3 Asia-Pacific Chip Packaging Market Size by Type (2016-2027) 8.3 Asia-Pacific Chip Packaging Market Size by Application
8.3.1 Asia-Pacific Chip Packaging Market Size by Application (2016-2021)
8.3.2 Asia-Pacific Chip Packaging Market Size by Application (2022-2027)
8.3.3 Asia-Pacific Chip Packaging Market Size by Application (2016-2027) 8.4 Asia-Pacific Chip Packaging Market Size by Region
8.4.1 Asia-Pacific Chip Packaging Market Size by Region (2016-2021)
8.4.2 Asia-Pacific Chip Packaging Market Size by Region (2022-2027)
8.4.3 China
8.4.4 Japan
8.4.5 South Korea
8.4.6 Southeast Asia
8.4.7 India
8.4.8 Australia 9 Latin America 9.1 Latin America Chip Packaging Market Size (2016-2027) 9.2 Latin America Chip Packaging Market Size by Type
9.2.1 Latin America Chip Packaging Market Size by Type (2016-2021)
9.2.2 Latin America Chip Packaging Market Size by Type (2022-2027)
9.2.3 Latin America Chip Packaging Market Size by Type (2016-2027) 9.3 Latin America Chip Packaging Market Size by Application
9.3.1 Latin America Chip Packaging Market Size by Application (2016-2021)
9.3.2 Latin America Chip Packaging Market Size by Application (2022-2027)
9.3.3 Latin America Chip Packaging Market Size by Application (2016-2027) 9.4 Latin America Chip Packaging Market Size by Country
9.4.1 Latin America Chip Packaging Market Size by Country (2016-2021)
9.4.2 Latin America Chip Packaging Market Size by Country (2022-2027)
9.4.3 Mexico
9.4.4 Brazil 10 Middle East & Africa 10.1 Middle East & Africa Chip Packaging Market Size (2016-2027) 10.2 Middle East & Africa Chip Packaging Market Size by Type
10.2.1 Middle East & Africa Chip Packaging Market Size by Type (2016-2021)
10.2.2 Middle East & Africa Chip Packaging Market Size by Type (2022-2027)
10.2.3 Middle East & Africa Chip Packaging Market Size by Type (2016-2027) 10.3 Middle East & Africa Chip Packaging Market Size by Application
10.3.1 Middle East & Africa Chip Packaging Market Size by Application (2016-2021)
10.3.2 Middle East & Africa Chip Packaging Market Size by Application (2022-2027)
10.3.3 Middle East & Africa Chip Packaging Market Size by Application (2016-2027) 10.4 Middle East & Africa Chip Packaging Market Size by Country
10.4.1 Middle East & Africa Chip Packaging Market Size by Country (2016-2021)
10.4.2 Middle East & Africa Chip Packaging Market Size by Country (2022-2027)
10.4.3 Turkey
10.4.4 Saudi Arabia
10.4.5 UAE 11 Key Players Profiles 11.1 ASE
11.1.1 ASE Company Details
11.1.2 ASE Business Overview
11.1.3 ASE Chip Packaging Introduction
11.1.4 ASE Revenue in Chip Packaging Business (2016-2021)
11.1.5 ASE Recent Development 11.2 Amkor
11.2.1 Amkor Company Details
11.2.2 Amkor Business Overview
11.2.3 Amkor Chip Packaging Introduction
11.2.4 Amkor Revenue in Chip Packaging Business (2016-2021)
11.2.5 Amkor Recent Development 11.3 JCET Group
11.3.1 JCET Group Company Details
11.3.2 JCET Group Business Overview
11.3.3 JCET Group Chip Packaging Introduction
11.3.4 JCET Group Revenue in Chip Packaging Business (2016-2021)
11.3.5 JCET Group Recent Development 11.4 Spil
11.4.1 Spil Company Details
11.4.2 Spil Business Overview
11.4.3 Spil Chip Packaging Introduction
11.4.4 Spil Revenue in Chip Packaging Business (2016-2021)
11.4.5 Spil Recent Development 11.5 Pti
11.5.1 Pti Company Details
11.5.2 Pti Business Overview
11.5.3 Pti Chip Packaging Introduction
11.5.4 Pti Revenue in Chip Packaging Business (2016-2021)
11.5.5 Pti Recent Development 11.6 Tongfu Microelectronics Co., Ltd.
11.6.1 Tongfu Microelectronics Co., Ltd. Company Details
11.6.2 Tongfu Microelectronics Co., Ltd. Business Overview
11.6.3 Tongfu Microelectronics Co., Ltd. Chip Packaging Introduction
11.6.4 Tongfu Microelectronics Co., Ltd. Revenue in Chip Packaging Business (2016-2021)
11.6.5 Tongfu Microelectronics Co., Ltd. Recent Development 11.7 Tianshui Huatian Technology Co., LTD
11.7.1 Tianshui Huatian Technology Co., LTD Company Details
11.7.2 Tianshui Huatian Technology Co., LTD Business Overview
11.7.3 Tianshui Huatian Technology Co., LTD Chip Packaging Introduction
11.7.4 Tianshui Huatian Technology Co., LTD Revenue in Chip Packaging Business (2016-2021)
11.7.5 Tianshui Huatian Technology Co., LTD Recent Development 11.8 UTAC Holdings Ltd
11.8.1 UTAC Holdings Ltd Company Details
11.8.2 UTAC Holdings Ltd Business Overview
11.8.3 UTAC Holdings Ltd Chip Packaging Introduction
11.8.4 UTAC Holdings Ltd Revenue in Chip Packaging Business (2016-2021)
11.8.5 UTAC Holdings Ltd Recent Development 11.9 Chipbond Technology Corporation
11.9.1 Chipbond Technology Corporation Company Details
11.9.2 Chipbond Technology Corporation Business Overview
11.9.3 Chipbond Technology Corporation Chip Packaging Introduction
11.9.4 Chipbond Technology Corporation Revenue in Chip Packaging Business (2016-2021)
11.9.5 Chipbond Technology Corporation Recent Development 11.10 Hana Micron
11.10.1 Hana Micron Company Details
11.10.2 Hana Micron Business Overview
11.10.3 Hana Micron Chip Packaging Introduction
11.10.4 Hana Micron Revenue in Chip Packaging Business (2016-2021)
11.10.5 Hana Micron Recent Development 11.11 Huatai electronics
11.11.1 Huatai electronics Company Details
11.11.2 Huatai electronics Business Overview
11.11.3 Huatai electronics Chip Packaging Introduction
11.11.4 Huatai electronics Revenue in Chip Packaging Business (2016-2021)
11.11.5 Huatai electronics Recent Development 11.12 East China Science and Technology Co. LTD
11.12.1 East China Science and Technology Co. LTD Company Details
11.12.2 East China Science and Technology Co. LTD Business Overview
11.12.3 East China Science and Technology Co. LTD Chip Packaging Introduction
11.12.4 East China Science and Technology Co. LTD Revenue in Chip Packaging Business (2016-2021)
11.12.5 East China Science and Technology Co. LTD Recent Development 11.13 NEPES
11.13.1 NEPES Company Details
11.13.2 NEPES Business Overview
11.13.3 NEPES Chip Packaging Introduction
11.13.4 NEPES Revenue in Chip Packaging Business (2016-2021)
11.13.5 NEPES Recent Development 11.14 Unisem
11.14.1 Unisem Company Details
11.14.2 Unisem Business Overview
11.14.3 Unisem Chip Packaging Introduction
11.14.4 Unisem Revenue in Chip Packaging Business (2016-2021)
11.14.5 Unisem Recent Development 11.15 ChipMOS Technologies
11.15.1 ChipMOS Technologies Company Details
11.15.2 ChipMOS Technologies Business Overview
11.15.3 ChipMOS Technologies Chip Packaging Introduction
11.15.4 ChipMOS Technologies Revenue in Chip Packaging Business (2016-2021)
11.15.5 ChipMOS Technologies Recent Development 11.16 Signitec
11.16.1 Signitec Company Details
11.16.2 Signitec Business Overview
11.16.3 Signitec Chip Packaging Introduction
11.16.4 Signitec Revenue in Chip Packaging Business (2016-2021)
11.16.5 Signitec Recent Development 11.17 Carsem
11.17.1 Carsem Company Details
11.17.2 Carsem Business Overview
11.17.3 Carsem Chip Packaging Introduction
11.17.4 Carsem Revenue in Chip Packaging Business (2016-2021)
11.17.5 Carsem Recent Development 11.18 King Yuan Electronics CO., LTD.
11.18.1 King Yuan Electronics CO., LTD. Company Details
11.18.2 King Yuan Electronics CO., LTD. Business Overview
11.18.3 King Yuan Electronics CO., LTD. Chip Packaging Introduction
11.18.4 King Yuan Electronics CO., LTD. Revenue in Chip Packaging Business (2016-2021)
11.18.5 King Yuan Electronics CO., LTD. Recent Development 12 Analyst’s Viewpoints/Conclusions 13 Appendix 13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source 13.2 Disclaimer 13.3 Author Details

 About Us

QY Research is a leading global market research and consulting company. Established in 2007 QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and custom research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship and our strong commitment to sustainability. Today, we are serving more than 4000 clients across five continents. Let�s allow us to work closely with you and build a bold and a better future.

 

https://iranwpd.com/

By hitesh